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Ultra-thin IC cooler | Compatible with 1U, FPGA, and CPU

Ultra-thin IC cooler (fan-equipped heat sink) that meets thermal management needs for high-density packaging.

This is an ultra-thin IC cooler (fan-equipped heat sink) designed to address heat dissipation measures in high-density implementation environments. It combines high heat dissipation performance through a cold-forged pin fin structure with space-saving design due to its integrated fan, achieving efficient cooling even in limited enclosure spaces. The JCC series uses aluminum and copper materials, featuring a low-profile design with dimensions of 51mm to 70mm square and a height of 13mm, making it suitable for cooling 1U servers, communication equipment, CPUs, FPGAs, and chipsets. The JSC series responds to further space-saving and safety needs with its ultra-thin structure of 10.7mm in height and models with fan guards. It allows for optimal model selection based on application, heat generation, and installation space, contributing to thermal management across a wide range of fields, including industrial PCs and embedded devices.